A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding
This paper introduces a simplified fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using anodic bonding. Anodic bonding provides the established advantages of wafer-bondingbased CMUT fabrication processes, including process simplicity, control over p...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 62(2015), 5 vom: 14. Mai, Seite 972-82
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| 1. Verfasser: |
Yamaner, F Yalçın
(VerfasserIn) |
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| Weitere Verfasser: |
Zhang, Xiao,
Oralkan, Ömer |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2015
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| Zugriff auf das übergeordnete Werk: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control
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| Schlagworte: | Journal Article
Research Support, N.I.H., Extramural
Research Support, Non-U.S. Gov't
Research Support, U.S. Gov't, Non-P.H.S.
Silicon Compounds
silicon nitride
QHB8T06IDK |
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