A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding

This paper introduces a simplified fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using anodic bonding. Anodic bonding provides the established advantages of wafer-bondingbased CMUT fabrication processes, including process simplicity, control over p...

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Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 62(2015), 5 vom: 14. Mai, Seite 972-82
1. Verfasser:	Yamaner, F Yalçın (VerfasserIn)
Weitere Verfasser:	Zhang, Xiao, Oralkan, Ömer
Format:	Online-Aufsatz
Sprache:	English
Veröffentlicht:	2015
Zugriff auf das übergeordnete Werk:	IEEE transactions on ultrasonics, ferroelectrics, and frequency control
Schlagworte:	Journal Article Research Support, N.I.H., Extramural Research Support, Non-U.S. Gov't Research Support, U.S. Gov't, Non-P.H.S. Silicon Compounds silicon nitride QHB8T06IDK