A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding

This paper introduces a simplified fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using anodic bonding. Anodic bonding provides the established advantages of wafer-bondingbased CMUT fabrication processes, including process simplicity, control over p...

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Publié dans:	IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 62(2015), 5 vom: 14. Mai, Seite 972-82
Auteur principal:	Yamaner, F Yalçın (Auteur)
Autres auteurs:	Zhang, Xiao, Oralkan, Ömer
Format:	Article en ligne
Langue:	English
Publié:	2015
Accès à la collection:	IEEE transactions on ultrasonics, ferroelectrics, and frequency control
Sujets:	Journal Article Research Support, N.I.H., Extramural Research Support, Non-U.S. Gov't Research Support, U.S. Gov't, Non-P.H.S. Silicon Compounds silicon nitride QHB8T06IDK