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|a 10.1063/5.0049521
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|a eng
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1 |
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|a Cook, Robert F
|e verfasserin
|4 aut
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1 |
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|a High-throughput bend-strengths of ultra-small polysilicon MEMS components
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|c 2021
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|a Text
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|a ƒaComputermedien
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|a Date Revised 12.10.2024
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|a published: Print
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|a Citation Status PubMed-not-MEDLINE
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| 520 |
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|a The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporated into a stochastic extreme-value strength framework. Agreement between experiment and prediction suggest that the ultra-small specimens may be at the limit of extreme-value scaling and contain only one strength-controlling flaw/specimen
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|a Journal Article
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1 |
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|a Boyce, Brad L
|e verfasserin
|4 aut
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| 700 |
1 |
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|a Friedman, Lawrence H
|e verfasserin
|4 aut
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| 700 |
1 |
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|a DelRio, Frank W
|e verfasserin
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|t Applied physics letters
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|u http://dx.doi.org/10.1063/5.0049521
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