High-throughput bend-strengths of ultra-small polysilicon MEMS components

The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporat...

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Détails bibliographiques
Publié dans:Applied physics letters. - 1998. - 118(2021), 20 vom: 17. Mai
Auteur principal: Cook, Robert F (Auteur)
Autres auteurs: Boyce, Brad L, Friedman, Lawrence H, DelRio, Frank W
Format: Article en ligne
Langue:English
Publié: 2021
Accès à la collection:Applied physics letters
Sujets:Journal Article
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520 |a The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporated into a stochastic extreme-value strength framework. Agreement between experiment and prediction suggest that the ultra-small specimens may be at the limit of extreme-value scaling and contain only one strength-controlling flaw/specimen 
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700 1 |a Friedman, Lawrence H  |e verfasserin  |4 aut 
700 1 |a DelRio, Frank W  |e verfasserin  |4 aut 
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