High-throughput bend-strengths of ultra-small polysilicon MEMS components
The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporat...
| Veröffentlicht in: | Applied physics letters. - 1998. - 118(2021), 20 vom: 15. Mai |
|---|---|
| 1. Verfasser: | |
| Weitere Verfasser: | , , |
| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2021
|
| Zugriff auf das übergeordnete Werk: | Applied physics letters |
| Schlagworte: | Journal Article |
| Zusammenfassung: | The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporated into a stochastic extreme-value strength framework. Agreement between experiment and prediction suggest that the ultra-small specimens may be at the limit of extreme-value scaling and contain only one strength-controlling flaw/specimen |
|---|---|
| Beschreibung: | Date Revised 12.10.2024 published: Print Citation Status PubMed-not-MEDLINE |
| ISSN: | 0003-6951 |
| DOI: | 10.1063/5.0049521 |