High-throughput bend-strengths of ultra-small polysilicon MEMS components

The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is measured using a high-throughput MEMS fabrication and testing method. The distribution is predicted from reference tests on tensile specimens and finite element analysis of the bend specimen geometry incorporat...

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Publié dans:	Applied physics letters. - 1998. - 118(2021), 20 vom: 17. Mai
Auteur principal:	Cook, Robert F (Auteur)
Autres auteurs:	Boyce, Brad L, Friedman, Lawrence H, DelRio, Frank W
Format:	Article en ligne
Langue:	English
Publié:	2021
Accès à la collection:	Applied physics letters
Sujets:	Journal Article