Hole-Carrier-Dominant Transport in 2D Single-Crystal Copper

© 2024 The Author(s). Advanced Materials published by Wiley‐VCH GmbH.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 36(2024), 36 vom: 18. Sept., Seite e2403783
1. Verfasser: Ok, Jong Mok (VerfasserIn)
Weitere Verfasser: Kang, Kyungrok, Hyun, Jounghoon, Lim, Chan-Young, Gim, Seonggeon, Hwang, Jinwoong, Denlinger, Jonathan D, Cheon, Miyeon, Regmi, Binod, Lee, Ji-Eun, Ryu, Hyejin, Kim, Su Jae, Lee, Yousil, Kim, Young-Hoon, Kim, Young-Min, Kim, Yeongkwan, Kim, Seong-Gon, Yang, Heejun, Jeong, Se-Young
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2024
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article grain boundary free hole carriers in Cu nonlinear Hall effect single‐crystal copper thin film triangular hole orbit
Beschreibung
Zusammenfassung:© 2024 The Author(s). Advanced Materials published by Wiley‐VCH GmbH.
In 2D noble metals like copper, the carrier scattering at grain boundaries has obscured the intrinsic nature of electronic transport. However, it is demonstrated that the intrinsic nature of transport by hole carriers in 2D copper can be revealed by growing thin films without grain boundaries. As even a slight deviation from the twin boundary is perceived as grain boundaries by electrons, it is only through the thorough elimination of grain boundaries that the hidden hole-like attribute of 2D single-crystal copper can be unmasked. Two types of Fermi surfaces, a large hexagonal Fermi surface centered at the zone center and the triangular Fermi surface around the zone corner, tightly matching to the calculated Fermi surface topology, confirmed by angle-resolved photoemission spectroscopy (ARPES) measurements and vivid nonlinear Hall effects of the 2D single-crystal copper account for the presence of hole carriers experimentally. This breakthrough suggests the potential to manipulate the majority carrier polarity in metals by means of grain boundary engineering in a 2D geometry
Beschreibung:Date Revised 18.09.2024
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.202403783