The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography

The challenges of patterning next generation integrated circuits have driven the semiconductor industry to look outside of traditional lithographic methods in order to continue cost effective size scaling. The directed self-assembly (DSA) of block copolymers (BCPs) is a nanofabrication technique use...

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Veröffentlicht in:Chemistry of materials : a publication of the American Chemical Society. - 1998. - 32(2020), 6 vom: 28.
1. Verfasser: Sunday, Daniel F (VerfasserIn)
Weitere Verfasser: Chen, Xuanxuan, Albrecht, Thomas R, Nowak, Derek, Delgadillo, Paulina Rincon, Dazai, Takahiro, Miyagi, Ken, Maehashi, Takaya, Yamazaki, Akiyoshi, Nealey, Paul F, Kline, R Joseph
Format: Aufsatz
Sprache:English
Veröffentlicht: 2020
Zugriff auf das übergeordnete Werk:Chemistry of materials : a publication of the American Chemical Society
Schlagworte:Journal Article