Complex High-Aspect-Ratio Metal Nanostructures by Secondary Sputtering Combined with Block Copolymer Self-Assembly

Détails bibliographiques
Publié dans:	Advanced materials (Deerfield Beach, Fla.). - 1998. - 28(2016), 38 vom: 04. Okt., Seite 8439-8445
Auteur principal:	Jeon, Hwan-Jin (Auteur)
Autres auteurs:	Kim, Ju Young, Jung, Woo-Bin, Jeong, Hyeon-Su, Kim, Yun Ho, Shin, Dong Ok, Jeong, Seong-Jun, Shin, Jonghwa, Kim, Sang Ouk, Jung, Hee-Tae
Format:	Article en ligne
Langue:	English
Publié:	2016
Accès à la collection:	Advanced materials (Deerfield Beach, Fla.)
Sujets:	Journal Article block copolymers high aspect ratio high resolution plasma reaction secondary sputtering


LEADER	01000caa a22002652 4500
001	NLM263101983
003	DE-627
005	20250220121359.0
007	cr uuu---uuuuu
008	231224s2016 xx \|\|\|\|\|o 00\| \|\|eng c
024	7		\|a 10.1002/adma.201602523 \|2 doi
028	5	2	\|a pubmed25n0876.xml
035			\|a (DE-627)NLM263101983
035			\|a (NLM)27488974
040			\|a DE-627 \|b ger \|c DE-627 \|e rakwb
041			\|a eng
100	1		\|a Jeon, Hwan-Jin \|e verfasserin \|4 aut
245	1	0	\|a Complex High-Aspect-Ratio Metal Nanostructures by Secondary Sputtering Combined with Block Copolymer Self-Assembly
264		1	\|c 2016
336			\|a Text \|b txt \|2 rdacontent
337			\|a ƒaComputermedien \|b c \|2 rdamedia
338			\|a ƒa Online-Ressource \|b cr \|2 rdacarrier
500			\|a Date Completed 17.07.2018
500			\|a Date Revised 01.10.2020
500			\|a published: Print-Electronic
500			\|a Citation Status PubMed-not-MEDLINE
520			\|a © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
520			\|a High-resolution (10 nm), high-areal density, high-aspect ratio (>5), and morphologically complex nanopatterns are fabricated from a single conventional block copolymer (BCP) structure with a 70 nm scale resolution and an aspect ratio of 1, through the secondary-sputtering phenomenon during the Ar-ion-bombardment process. This approach provides a foundation for the design of new routes to BCP lithography
650		4	\|a Journal Article
650		4	\|a block copolymers
650		4	\|a high aspect ratio
650		4	\|a high resolution
650		4	\|a plasma reaction
650		4	\|a secondary sputtering
700	1		\|a Kim, Ju Young \|e verfasserin \|4 aut
700	1		\|a Jung, Woo-Bin \|e verfasserin \|4 aut
700	1		\|a Jeong, Hyeon-Su \|e verfasserin \|4 aut
700	1		\|a Kim, Yun Ho \|e verfasserin \|4 aut
700	1		\|a Shin, Dong Ok \|e verfasserin \|4 aut
700	1		\|a Jeong, Seong-Jun \|e verfasserin \|4 aut
700	1		\|a Shin, Jonghwa \|e verfasserin \|4 aut
700	1		\|a Kim, Sang Ouk \|e verfasserin \|4 aut
700	1		\|a Jung, Hee-Tae \|e verfasserin \|4 aut
773	0	8	\|i Enthalten in \|t Advanced materials (Deerfield Beach, Fla.) \|d 1998 \|g 28(2016), 38 vom: 04. Okt., Seite 8439-8445 \|w (DE-627)NLM098206397 \|x 1521-4095 \|7 nnns
773	1	8	\|g volume:28 \|g year:2016 \|g number:38 \|g day:04 \|g month:10 \|g pages:8439-8445
856	4	0	\|u http://dx.doi.org/10.1002/adma.201602523 \|3 Volltext
912			\|a GBV_USEFLAG_A
912			\|a SYSFLAG_A
912			\|a GBV_NLM
912			\|a GBV_ILN_350
951			\|a AR
952			\|d 28 \|j 2016 \|e 38 \|b 04 \|c 10 \|h 8439-8445