© 2024 UChicago Argonne, LLC and The Author(s). Advanced Materials published by Wiley‐VCH GmbH.
Détails bibliographiques
Publié dans: | Advanced materials (Deerfield Beach, Fla.). - 1998. - 36(2024), 49 vom: 13. Dez., Seite e2412570
|
Auteur principal: |
Wang, Xiyang
(Auteur) |
Autres auteurs: |
Li, Zhen,
Li, Xinbo,
Gao, Chuan,
Pu, Yinghui,
Zhong, Xia,
Qian, Jingyu,
Zeng, Minli,
Chu, Xuefeng,
Chen, Zuolong,
Redshaw, Carl,
Zhou, Hua,
Sun, Chengjun,
Regier, Tom,
King, Graham,
Dynes, James J,
Zhang, Bingsen,
Zhu, Yanqiu,
Li, Guangshe,
Peng, Yue,
Wang, Nannan,
Wu, Yimin A |
Format: | Article en ligne
|
Langue: | English |
Publié: |
2024
|
Accès à la collection: | Advanced materials (Deerfield Beach, Fla.)
|
Sujets: | Journal Article
Cu nanoparticles
in situ spectroscopies
metal‐support interactions
reverse electron transfer
strong embedded interface |