Mold-Free Manufacturing of Highly Sensitive and Fast-Response Pressure Sensors Through High-Resolution 3D Printing and Conformal Oxidative Chemical Vapor Deposition Polymers
© 2023 The Authors. Advanced Materials published by Wiley-VCH GmbH.
| Veröffentlicht in: | Advanced materials (Deerfield Beach, Fla.). - 1998. - 35(2023), 41 vom: 01. Okt., Seite e2304070 |
|---|---|
| 1. Verfasser: | |
| Weitere Verfasser: | , , , , , , , , |
| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2023
|
| Zugriff auf das übergeordnete Werk: | Advanced materials (Deerfield Beach, Fla.) |
| Schlagworte: | Journal Article 3D printing chemical vapor deposition conductive polymers mold-free pressure sensors ultrafast response |
| Zusammenfassung: | © 2023 The Authors. Advanced Materials published by Wiley-VCH GmbH. A new manufacturing paradigm is showcased to exclude conventional mold-dependent manufacturing of pressure sensors, which typically requires a series of complex and expensive patterning processes. This mold-free manufacturing leverages high-resolution 3D-printed multiscale microstructures as the substrate and a gas-phase conformal polymer coating technique to complete the mold-free sensing platform. The array of dome and spike structures with a controlled spike density of a 3D-printed substrate ensures a large contact surface with pressures applied and extended linearity in a wider pressure range. For uniform coating of sensing elements on the microstructured surface, oxidative chemical vapor deposition is employed to deposit a highly conformal and conductive sensing element, poly(3,4-ethylenedioxythiophene) at low temperatures (<60 °C). The fabricated pressure sensor reacts sensitively to various ranges of pressures (up to 185 kPa-1 ) depending on the density of the multiscale features and shows an ultrafast response time (≈36 µs). The mechanism investigations through the finite element analysis identify the effect of the multiscale structure on the figure-of-merit sensing performance. These unique findings are expected to be of significant relevance to technology that requires higher sensing capability, scalability, and facile adjustment of a sensor geometry in a cost-effective manufacturing manner |
|---|---|
| Beschreibung: | Date Revised 20.10.2023 published: Print-Electronic Citation Status PubMed-not-MEDLINE |
| ISSN: | 1521-4095 |
| DOI: | 10.1002/adma.202304070 |