Interface Capture Effect Printing Atomic-Thick 2D Semiconductor Thin Films

© 2022 Wiley-VCH GmbH.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 34(2022), 49 vom: 29. Dez., Seite e2207392
1. Verfasser: Li, Lihong (VerfasserIn)
Weitere Verfasser: Yu, Xiaoxia, Lin, Zhaoyang, Cai, Zhenren, Cao, Yawei, Kong, Wei, Xiang, Zhongyuan, Gu, Zhengkun, Xing, Xianran, Duan, Xiangfeng, Song, Yanlin
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2022
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article 2D materials direct-writing printing transistors
Beschreibung
Zusammenfassung:© 2022 Wiley-VCH GmbH.
2D semiconductor crystals offer the opportunity to further extend Moore's law to the atomic scale. For practical and low-cost electronic applications, directly printing devices on substrates is advantageous compared to conventional microfabrication techniques that utilize expensive photolithography, etching, and vacuum-metallization processes. However, the currently printed 2D transistors are plagued by unsatisfactory electrical performance, thick semiconductor layers, and low device density. Herein, a facile and scalable 2D semiconductor printing strategy is demonstrated utilizing the interface capture effect and hyperdispersed 2D nanosheet ink to fabricate high-quality and atomic-thick semiconductor thin-film arrays without additional surfactants. Printed robust thin-film transistors using 2D semiconductors (e.g., MoS2 ) and 2D conductive electrodes (e.g., graphene) exhibit high electrical performance, including a carrier mobility of up to 6.7 cm2 V-1 s-1 and an on/off ratio of 2 × 106 at 25 °C. As a proof of concept, 2D transistors are printed with a density of ≈47 000 devices per square centimeter. In addition, this method can be applied to many other 2D materials, such as NbSe2 , Bi2 Se3 , and black phosphorus, for printing diverse high-quality thin films. Thus, the strategy of printable 2D thin-film transistors provides a scalable pathway for the facile manufacturing of high-performance electronics at an affordable cost
Beschreibung:Date Completed 09.12.2022
Date Revised 09.12.2022
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.202207392