A Flash-Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin-Film μLEDs

A Flash-Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin-Film μLEDs

© 2021 Wiley-VCH GmbH.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 33(2021), 13 vom: 10. Apr., Seite e2007186
1. Verfasser: Shin, Jung Ho (VerfasserIn)
Weitere Verfasser: Park, Jung Hwan, Seo, Jeongmin, Im, Tae Hong, Kim, Jong Chan, Lee, Han Eol, Kim, Do Hyun, Woo, Kie Young, Jeong, Hu Young, Cho, Yong-Hoon, Kim, Taek-Soo, Kang, Il-Suk, Lee, Keon Jae
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2021
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article Cu electrodes glass interface chemistry physical interlocking thin-film μLEDs
Beschreibung
Zusammenfassung:© 2021 Wiley-VCH GmbH.
A robust Cu conductor on a glass substrate for thin-film μLEDs using the flash-induced chemical/physical interlocking between Cu and glass is reported. During millisecond light irradiation, CuO nanoparticles (NPs) on the display substrate are transformed into a conductive Cu film by reduction and sintering. At the same time, intensive heating at the boundary of CuO NPs and glass chemically induces the formation of an ultrathin Cu2 O interlayer within the Cu/glass interface for strong adhesion. Cu nanointerlocking occurs by transient glass softening and interface fluctuation to increase the contact area. Owing to these flash-induced interfacial interactions, the flash-activated Cu electrode exhibits an adhesion energy of 10 J m-2 , which is five times higher than that of vacuum-deposited Cu. An AlGaInP thin-film vertical μLED (VLED) forms an electrical interconnection with the flash-induced Cu electrode via an ACF bonding process, resulting in a high optical power density of 41 mW mm-2 . The Cu conductor enables reliable VLED operation regardless of harsh thermal stress and moisture infiltration under a high-temperature storage test, temperature humidity test, and thermal shock test. 50 × 50 VLED arrays transferred onto the flash-induced robust Cu electrode show high illumination yield and uniform distribution of forward voltage, peak wavelength, and device temperature
Beschreibung:Date Revised 02.04.2021
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.202007186