Recovery of high-grade copper from metal-rich particles of waste printed circuit boards by ball milling and sieving

In this paper, a method of ball milling and sieving is proposed for recovery of high-grade copper from waste printed circuit boards (WPCBs). The effects of the milling time on the metals grade and recovery of the Cu, Sn and Pb during mechanical treatment were investigated. The results showed that, a...

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Veröffentlicht in:Environmental technology. - 1993. - 43(2022), 4 vom: 01. Jan., Seite 514-523
1. Verfasser: Liu, Fangfang (VerfasserIn)
Weitere Verfasser: Chen, Weiping, Wan, Bingbing, Chen, Huanda, Ling, Zicheng, Chen, Zhiping, Fu, Zhiqiang
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2022
Zugriff auf das übergeordnete Werk:Environmental technology
Schlagworte:Journal Article Cu Recovery ball milling sieving waste printed circuit boards Metals Copper 789U1901C5
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520 |a In this paper, a method of ball milling and sieving is proposed for recovery of high-grade copper from waste printed circuit boards (WPCBs). The effects of the milling time on the metals grade and recovery of the Cu, Sn and Pb during mechanical treatment were investigated. The results showed that, after 3 cycles of ball milling and sieving, the content of Cu was enriched to 94.72 wt.% from the initial 74.22 wt.% with a high recovery rate of 86.78%. Moreover, the contents of Sn and Pb were enriched to 28.27 wt.% and 18.86 wt.% from 10.13 wt.% and 6.63 wt.% in the by-products, respectively. However, excessive grinding occurred when the milling time was longer than 3 h and led to a sharp decrease in Cu recovery. The X-ray diffraction (XRD) patterns indicated that the metal phases mainly comprised pure Cu, Sn, Pb in the WPCB particles, while a Cu-Sn alloy was formed during the milling process, and the Cu-Sn alloy was also enriched in the tailings. The results presented here establish that ball milling and sieving is an alternative approach to recovering high-grade copper from WPCBs 
650 4 |a Journal Article 
650 4 |a Cu 
650 4 |a Recovery 
650 4 |a ball milling 
650 4 |a sieving 
650 4 |a waste printed circuit boards 
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650 7 |a Copper  |2 NLM 
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700 1 |a Chen, Weiping  |e verfasserin  |4 aut 
700 1 |a Wan, Bingbing  |e verfasserin  |4 aut 
700 1 |a Chen, Huanda  |e verfasserin  |4 aut 
700 1 |a Ling, Zicheng  |e verfasserin  |4 aut 
700 1 |a Chen, Zhiping  |e verfasserin  |4 aut 
700 1 |a Fu, Zhiqiang  |e verfasserin  |4 aut 
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773 1 8 |g volume:43  |g year:2022  |g number:4  |g day:01  |g month:01  |g pages:514-523 
856 4 0 |u http://dx.doi.org/10.1080/09593330.2020.1795932  |3 Volltext 
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