Recovery of high-grade copper from metal-rich particles of waste printed circuit boards by ball milling and sieving
In this paper, a method of ball milling and sieving is proposed for recovery of high-grade copper from waste printed circuit boards (WPCBs). The effects of the milling time on the metals grade and recovery of the Cu, Sn and Pb during mechanical treatment were investigated. The results showed that, a...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Environmental technology. - 1993. - 43(2022), 4 vom: 01. Jan., Seite 514-523
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| 1. Verfasser: |
Liu, Fangfang
(VerfasserIn) |
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| Weitere Verfasser: |
Chen, Weiping,
Wan, Bingbing,
Chen, Huanda,
Ling, Zicheng,
Chen, Zhiping,
Fu, Zhiqiang |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2022
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| Zugriff auf das übergeordnete Werk: | Environmental technology
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| Schlagworte: | Journal Article
Cu
Recovery
ball milling
sieving
waste printed circuit boards
Metals
Copper
789U1901C5 |
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