Flexible Temperature-Invariant Polymer Dielectrics with Large Bandgap

Flexible Temperature-Invariant Polymer Dielectrics with Large Bandgap

© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 32(2020), 21 vom: 02. Mai, Seite e2000499
1. Verfasser: Wu, Chao (VerfasserIn)
Weitere Verfasser: Deshmukh, Ajinkya A, Li, Zongze, Chen, Lihua, Alamri, Abdullah, Wang, Yifei, Ramprasad, Rampi, Sotzing, Gregory A, Cao, Yang
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2020
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article capacitors elevated temperature energy storage large bandgap polymer dielectrics
Beschreibung
Zusammenfassung:© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Flexible dielectrics operable under simultaneous electric and thermal extremes are critical to advanced electronics for ultrahigh densities and/or harsh conditions. However, conventional high-performance polymer dielectrics generally have conjugated aromatic backbones, leading to limited bandgaps and hence high conduction loss and poor energy densities, especially at elevated temperatures. A polyoxafluoronorbornene is reported, which has a key design feature in that it is a polyolefin consisting of repeating units of fairly rigid fused bicyclic structures and alkenes separated by freely rotating single bonds, endowing it with a large bandgap of ≈5 eV and flexibility, while being temperature-invariantly stable over -160 to 160 °C. At 150 °C, the polyoxafluoronorbornene exhibits an electrical conductivity two orders of magnitude lower than the best commercial high-temperature polymers, and features an unprecedented discharged energy density of 5.7 J cm-3 far outperforming the best reported flexible dielectrics. The design strategy uncovered in this work reveals a hitherto unexplored space for the design of scalable and efficient polymer dielectrics for electrical power and electronic systems under concurrent harsh electrical and thermal conditions
Beschreibung:Date Revised 30.09.2020
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.202000499