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231225s2019 xx |||||o 00| ||eng c |
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|a 10.1021/acs.langmuir.9b01250
|2 doi
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|a eng
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| 100 |
1 |
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|a Rana, Shammi
|e verfasserin
|4 aut
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| 245 |
1 |
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|a Perspective on the Interfacial Reduction Reaction
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|c 2019
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| 336 |
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|a Text
|b txt
|2 rdacontent
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|a ƒaComputermedien
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|a ƒa Online-Ressource
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|a Date Revised 23.09.2019
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|a published: Print-Electronic
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|a Citation Status PubMed-not-MEDLINE
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|a Chemical reactions involving oxidation and reduction processes at interfaces may vary from those in conventional liquid-phase or solid-phase reactions and could influence the overall outcome. This article primarily features a study on metal-ligand coordination at the solid-liquid interface. Of particular mention is the spontaneous reduction of Cu(II) to Cu(I) at a solid-liquid interface without the need of any extraneous reducing agent, unlike in the liquid-phase reaction whereby no reduction of Cu(II) to Cu(I) took place. As a consequence of the interfacial reduction reaction (IRR), thin films of Cu-TCNQ (tetracyanoquinodimethane) and Cu-HCF (hexacyanoferrate) were successfully deposited onto a thiol-functionalized Au substrate via a layer-by-layer (LbL) method. IRR is anticipated to be useful in generating new functional and stimuli-responsive materials, which are otherwise difficult to achieve via conventional liquid-phase reactions
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|a Journal Article
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|a Sindhu, Pooja
|e verfasserin
|4 aut
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1 |
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|a Ballav, Nirmalya
|e verfasserin
|4 aut
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| 773 |
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|i Enthalten in
|t Langmuir : the ACS journal of surfaces and colloids
|d 1992
|g 35(2019), 30 vom: 30. Juli, Seite 9647-9659
|w (DE-627)NLM098181009
|x 1520-5827
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| 773 |
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|g volume:35
|g year:2019
|g number:30
|g day:30
|g month:07
|g pages:9647-9659
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|u http://dx.doi.org/10.1021/acs.langmuir.9b01250
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