Perspective on the Interfacial Reduction Reaction
Chemical reactions involving oxidation and reduction processes at interfaces may vary from those in conventional liquid-phase or solid-phase reactions and could influence the overall outcome. This article primarily features a study on metal-ligand coordination at the solid-liquid interface. Of parti...
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 35(2019), 30 vom: 30. Juli, Seite 9647-9659 |
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| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2019
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids |
| Schlagworte: | Journal Article |
| Zusammenfassung: | Chemical reactions involving oxidation and reduction processes at interfaces may vary from those in conventional liquid-phase or solid-phase reactions and could influence the overall outcome. This article primarily features a study on metal-ligand coordination at the solid-liquid interface. Of particular mention is the spontaneous reduction of Cu(II) to Cu(I) at a solid-liquid interface without the need of any extraneous reducing agent, unlike in the liquid-phase reaction whereby no reduction of Cu(II) to Cu(I) took place. As a consequence of the interfacial reduction reaction (IRR), thin films of Cu-TCNQ (tetracyanoquinodimethane) and Cu-HCF (hexacyanoferrate) were successfully deposited onto a thiol-functionalized Au substrate via a layer-by-layer (LbL) method. IRR is anticipated to be useful in generating new functional and stimuli-responsive materials, which are otherwise difficult to achieve via conventional liquid-phase reactions |
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| Beschreibung: | Date Revised 23.09.2019 published: Print-Electronic Citation Status PubMed-not-MEDLINE |
| ISSN: | 1520-5827 |
| DOI: | 10.1021/acs.langmuir.9b01250 |