Universal Route to Impart Orthogonality to Polymer Semiconductors for Sub-Micrometer Tandem Electronics

© 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Détails bibliographiques
Publié dans:Advanced materials (Deerfield Beach, Fla.). - 1998. - 31(2019), 28 vom: 30. Juli, Seite e1901400
Auteur principal: Park, Han Wool (Auteur)
Autres auteurs: Choi, Keun-Yeong, Shin, Jihye, Kang, Boseok, Hwang, Haejung, Choi, Shinyoung, Song, Aeran, Kim, Jaehee, Kweon, Hyukmin, Kim, Seunghan, Chung, Kwun-Bum, Kim, BongSoo, Cho, Kilwon, Kwon, Soon-Ki, Kim, Yun-Hi, Kang, Moon Sung, Lee, Hojin, Kim, Do Hwan
Format: Article en ligne
Langue:English
Publié: 2019
Accès à la collection:Advanced materials (Deerfield Beach, Fla.)
Sujets:Journal Article orthogonal polymer semiconductor gel photolithography semi-interpenetrating diphasic polymer network sequential solution processes sub-micrometer tandem electronics