Universal Route to Impart Orthogonality to Polymer Semiconductors for Sub-Micrometer Tandem Electronics

© 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 31(2019), 28 vom: 30. Juli, Seite e1901400
1. Verfasser: Park, Han Wool (VerfasserIn)
Weitere Verfasser: Choi, Keun-Yeong, Shin, Jihye, Kang, Boseok, Hwang, Haejung, Choi, Shinyoung, Song, Aeran, Kim, Jaehee, Kweon, Hyukmin, Kim, Seunghan, Chung, Kwun-Bum, Kim, BongSoo, Cho, Kilwon, Kwon, Soon-Ki, Kim, Yun-Hi, Kang, Moon Sung, Lee, Hojin, Kim, Do Hwan
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2019
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article orthogonal polymer semiconductor gel photolithography semi-interpenetrating diphasic polymer network sequential solution processes sub-micrometer tandem electronics
LEADER 01000naa a22002652 4500
001 NLM296826979
003 DE-627
005 20231225090658.0
007 cr uuu---uuuuu
008 231225s2019 xx |||||o 00| ||eng c
024 7 |a 10.1002/adma.201901400  |2 doi 
028 5 2 |a pubmed24n0989.xml 
035 |a (DE-627)NLM296826979 
035 |a (NLM)31063271 
040 |a DE-627  |b ger  |c DE-627  |e rakwb 
041 |a eng 
100 1 |a Park, Han Wool  |e verfasserin  |4 aut 
245 1 0 |a Universal Route to Impart Orthogonality to Polymer Semiconductors for Sub-Micrometer Tandem Electronics 
264 1 |c 2019 
336 |a Text  |b txt  |2 rdacontent 
337 |a ƒaComputermedien  |b c  |2 rdamedia 
338 |a ƒa Online-Ressource  |b cr  |2 rdacarrier 
500 |a Date Revised 30.09.2020 
500 |a published: Print-Electronic 
500 |a Citation Status PubMed-not-MEDLINE 
520 |a © 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. 
520 |a A universal method that enables utilization of conventional photolithography for processing a variety of polymer semiconductors is developed. The method relies on imparting chemical and physical orthogonality to a polymer film via formation of a semi-interpenetrating diphasic polymer network with a bridged polysilsesquioxane structure, which is termed an orthogonal polymer semiconductor gel. The synthesized gel films remain tolerant to various chemical and physical etching processes involved in photolithography, thereby facilitating fabrication of high-resolution patterns of polymer semiconductors. This method is utilized for fabricating tandem electronics, including pn-complementary inverter logic devices and pixelated polymer light-emitting diodes, which require deposition of multiple polymer semiconductors through solution processes. This novel and universal method is expected to significantly influence the development of advanced polymer electronics requiring sub-micrometer tandem structures 
650 4 |a Journal Article 
650 4 |a orthogonal polymer semiconductor gel 
650 4 |a photolithography 
650 4 |a semi-interpenetrating diphasic polymer network 
650 4 |a sequential solution processes 
650 4 |a sub-micrometer tandem electronics 
700 1 |a Choi, Keun-Yeong  |e verfasserin  |4 aut 
700 1 |a Shin, Jihye  |e verfasserin  |4 aut 
700 1 |a Kang, Boseok  |e verfasserin  |4 aut 
700 1 |a Hwang, Haejung  |e verfasserin  |4 aut 
700 1 |a Choi, Shinyoung  |e verfasserin  |4 aut 
700 1 |a Song, Aeran  |e verfasserin  |4 aut 
700 1 |a Kim, Jaehee  |e verfasserin  |4 aut 
700 1 |a Kweon, Hyukmin  |e verfasserin  |4 aut 
700 1 |a Kim, Seunghan  |e verfasserin  |4 aut 
700 1 |a Chung, Kwun-Bum  |e verfasserin  |4 aut 
700 1 |a Kim, BongSoo  |e verfasserin  |4 aut 
700 1 |a Cho, Kilwon  |e verfasserin  |4 aut 
700 1 |a Kwon, Soon-Ki  |e verfasserin  |4 aut 
700 1 |a Kim, Yun-Hi  |e verfasserin  |4 aut 
700 1 |a Kang, Moon Sung  |e verfasserin  |4 aut 
700 1 |a Lee, Hojin  |e verfasserin  |4 aut 
700 1 |a Kim, Do Hwan  |e verfasserin  |4 aut 
773 0 8 |i Enthalten in  |t Advanced materials (Deerfield Beach, Fla.)  |d 1998  |g 31(2019), 28 vom: 30. Juli, Seite e1901400  |w (DE-627)NLM098206397  |x 1521-4095  |7 nnns 
773 1 8 |g volume:31  |g year:2019  |g number:28  |g day:30  |g month:07  |g pages:e1901400 
856 4 0 |u http://dx.doi.org/10.1002/adma.201901400  |3 Volltext 
912 |a GBV_USEFLAG_A 
912 |a SYSFLAG_A 
912 |a GBV_NLM 
912 |a GBV_ILN_350 
951 |a AR 
952 |d 31  |j 2019  |e 28  |b 30  |c 07  |h e1901400