|
|
|
|
LEADER |
01000caa a22002652 4500 |
001 |
NLM28663094X |
003 |
DE-627 |
005 |
20240229161850.0 |
007 |
cr uuu---uuuuu |
008 |
231225s2018 xx |||||o 00| ||eng c |
024 |
7 |
|
|a 10.1002/adma.201803109
|2 doi
|
028 |
5 |
2 |
|a pubmed24n1308.xml
|
035 |
|
|
|a (DE-627)NLM28663094X
|
035 |
|
|
|a (NLM)30022534
|
040 |
|
|
|a DE-627
|b ger
|c DE-627
|e rakwb
|
041 |
|
|
|a eng
|
100 |
1 |
|
|a Zhou, Guanyu
|e verfasserin
|4 aut
|
245 |
1 |
0 |
|a High-Mobility Helical Tellurium Field-Effect Transistors Enabled by Transfer-Free, Low-Temperature Direct Growth
|
264 |
|
1 |
|c 2018
|
336 |
|
|
|a Text
|b txt
|2 rdacontent
|
337 |
|
|
|a ƒaComputermedien
|b c
|2 rdamedia
|
338 |
|
|
|a ƒa Online-Ressource
|b cr
|2 rdacarrier
|
500 |
|
|
|a Date Revised 27.02.2024
|
500 |
|
|
|a published: Print-Electronic
|
500 |
|
|
|a Citation Status Publisher
|
520 |
|
|
|a © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
|
520 |
|
|
|a The transfer-free direct growth of high-performance materials and devices can enable transformative new technologies. Here, room-temperature field-effect hole mobilities as high as 707 cm2 V-1 s-1 are reported, achieved using transfer-free, low-temperature (≤120 °C) direct growth of helical tellurium (Te) nanostructure devices on SiO2 /Si. The Te nanostructures exhibit significantly higher device performance than other low-temperature grown semiconductors, and it is demonstrated that through careful control of the growth process, high-performance Te can be grown on other technologically relevant substrates including flexible plastics like polyethylene terephthalate and graphene in addition to amorphous oxides like SiO2 /Si and HfO2 . The morphology of the Te films can be tailored by the growth temperature, and different carrier scattering mechanisms are identified for films with different morphologies. The transfer-free direct growth of high-mobility Te devices can enable major technological breakthroughs, as the low-temperature growth and fabrication is compatible with the severe thermal budget constraints of emerging applications. For example, vertical integration of novel devices atop a silicon complementary metal oxide semiconductor platform (thermal budget <450 °C) has been theoretically shown to provide a 10× systems level performance improvement, while flexible and wearable electronics (thermal budget <200 °C) can revolutionize defense and medical applications
|
650 |
|
4 |
|a Journal Article
|
650 |
|
4 |
|a MBE growth
|
650 |
|
4 |
|a high-mobility filed effect transistor
|
650 |
|
4 |
|a low-temperature growth
|
650 |
|
4 |
|a tellurium
|
650 |
|
4 |
|a transfer-free device fabrication
|
700 |
1 |
|
|a Addou, Rafik
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Wang, Qingxiao
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Honari, Shahin
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Cormier, Christopher R
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Cheng, Lanxia
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Yue, Ruoyu
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Smyth, Christopher M
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Laturia, Akash
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Kim, Jiyoung
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Vandenberghe, William G
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Kim, Moon J
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Wallace, Robert M
|e verfasserin
|4 aut
|
700 |
1 |
|
|a Hinkle, Christopher L
|e verfasserin
|4 aut
|
773 |
0 |
8 |
|i Enthalten in
|t Advanced materials (Deerfield Beach, Fla.)
|d 1998
|g (2018) vom: 18. Juli, Seite e1803109
|w (DE-627)NLM098206397
|x 1521-4095
|7 nnns
|
773 |
1 |
8 |
|g year:2018
|g day:18
|g month:07
|g pages:e1803109
|
856 |
4 |
0 |
|u http://dx.doi.org/10.1002/adma.201803109
|3 Volltext
|
912 |
|
|
|a GBV_USEFLAG_A
|
912 |
|
|
|a SYSFLAG_A
|
912 |
|
|
|a GBV_NLM
|
912 |
|
|
|a GBV_ILN_350
|
951 |
|
|
|a AR
|
952 |
|
|
|j 2018
|b 18
|c 07
|h e1803109
|