High-Mobility Helical Tellurium Field-Effect Transistors Enabled by Transfer-Free, Low-Temperature Direct Growth

© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - (2018) vom: 18. Juli, Seite e1803109
1. Verfasser: Zhou, Guanyu (VerfasserIn)
Weitere Verfasser: Addou, Rafik, Wang, Qingxiao, Honari, Shahin, Cormier, Christopher R, Cheng, Lanxia, Yue, Ruoyu, Smyth, Christopher M, Laturia, Akash, Kim, Jiyoung, Vandenberghe, William G, Kim, Moon J, Wallace, Robert M, Hinkle, Christopher L
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2018
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article MBE growth high-mobility filed effect transistor low-temperature growth tellurium transfer-free device fabrication
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520 |a The transfer-free direct growth of high-performance materials and devices can enable transformative new technologies. Here, room-temperature field-effect hole mobilities as high as 707 cm2 V-1 s-1 are reported, achieved using transfer-free, low-temperature (≤120 °C) direct growth of helical tellurium (Te) nanostructure devices on SiO2 /Si. The Te nanostructures exhibit significantly higher device performance than other low-temperature grown semiconductors, and it is demonstrated that through careful control of the growth process, high-performance Te can be grown on other technologically relevant substrates including flexible plastics like polyethylene terephthalate and graphene in addition to amorphous oxides like SiO2 /Si and HfO2 . The morphology of the Te films can be tailored by the growth temperature, and different carrier scattering mechanisms are identified for films with different morphologies. The transfer-free direct growth of high-mobility Te devices can enable major technological breakthroughs, as the low-temperature growth and fabrication is compatible with the severe thermal budget constraints of emerging applications. For example, vertical integration of novel devices atop a silicon complementary metal oxide semiconductor platform (thermal budget <450 °C) has been theoretically shown to provide a 10× systems level performance improvement, while flexible and wearable electronics (thermal budget <200 °C) can revolutionize defense and medical applications 
650 4 |a Journal Article 
650 4 |a MBE growth 
650 4 |a high-mobility filed effect transistor 
650 4 |a low-temperature growth 
650 4 |a tellurium 
650 4 |a transfer-free device fabrication 
700 1 |a Addou, Rafik  |e verfasserin  |4 aut 
700 1 |a Wang, Qingxiao  |e verfasserin  |4 aut 
700 1 |a Honari, Shahin  |e verfasserin  |4 aut 
700 1 |a Cormier, Christopher R  |e verfasserin  |4 aut 
700 1 |a Cheng, Lanxia  |e verfasserin  |4 aut 
700 1 |a Yue, Ruoyu  |e verfasserin  |4 aut 
700 1 |a Smyth, Christopher M  |e verfasserin  |4 aut 
700 1 |a Laturia, Akash  |e verfasserin  |4 aut 
700 1 |a Kim, Jiyoung  |e verfasserin  |4 aut 
700 1 |a Vandenberghe, William G  |e verfasserin  |4 aut 
700 1 |a Kim, Moon J  |e verfasserin  |4 aut 
700 1 |a Wallace, Robert M  |e verfasserin  |4 aut 
700 1 |a Hinkle, Christopher L  |e verfasserin  |4 aut 
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