Biodegradable Electronic Systems in 3D, Heterogeneously Integrated Formats

© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 30(2018), 11 vom: 25. März
1. Verfasser: Chang, Jan-Kai (VerfasserIn)
Weitere Verfasser: Chang, Hui-Ping, Guo, Qinglei, Koo, Jahyun, Wu, Chih-I, Rogers, John A
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2018
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article 3D integration biodegradable electronics flexible devices heterogeneous integration transfer printing Silicon Z4152N8IUI
LEADER 01000naa a22002652 4500
001 NLM280116489
003 DE-627
005 20231225024608.0
007 cr uuu---uuuuu
008 231225s2018 xx |||||o 00| ||eng c
024 7 |a 10.1002/adma.201704955  |2 doi 
028 5 2 |a pubmed24n0933.xml 
035 |a (DE-627)NLM280116489 
035 |a (NLM)29349821 
040 |a DE-627  |b ger  |c DE-627  |e rakwb 
041 |a eng 
100 1 |a Chang, Jan-Kai  |e verfasserin  |4 aut 
245 1 0 |a Biodegradable Electronic Systems in 3D, Heterogeneously Integrated Formats 
264 1 |c 2018 
336 |a Text  |b txt  |2 rdacontent 
337 |a ƒaComputermedien  |b c  |2 rdamedia 
338 |a ƒa Online-Ressource  |b cr  |2 rdacarrier 
500 |a Date Completed 07.03.2019 
500 |a Date Revised 30.09.2020 
500 |a published: Print-Electronic 
500 |a Citation Status MEDLINE 
520 |a © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. 
520 |a Biodegradable electronic systems represent an emerging class of technology with unique application possibilities, from temporary biomedical implants to "green" consumer gadgets. This paper introduces materials and processing methods for 3D, heterogeneously integrated devices of this type, with various functional examples in sophisticated forms of silicon-based electronics. Specifically, techniques for performing multilayer assembly by transfer printing and for fabricating layer-to-layer vias and interconnects by lithographic procedures serve as routes to biodegradable, 3D integrated circuits composed of functional building blocks formed using specialized approaches or sourced from commercial semiconductor foundries. Demonstration examples range from logic gates and analog circuits that undergo functional transformation by transience to systems that integrate multilayer resistive sensors for in situ, continuous electrical monitoring of the processes of transience. The results significantly expand the scope of engineering options for biodegradable electronics and other types of transient microsystem technologies 
650 4 |a Journal Article 
650 4 |a 3D integration 
650 4 |a biodegradable electronics 
650 4 |a flexible devices 
650 4 |a heterogeneous integration 
650 4 |a transfer printing 
650 7 |a Silicon  |2 NLM 
650 7 |a Z4152N8IUI  |2 NLM 
700 1 |a Chang, Hui-Ping  |e verfasserin  |4 aut 
700 1 |a Guo, Qinglei  |e verfasserin  |4 aut 
700 1 |a Koo, Jahyun  |e verfasserin  |4 aut 
700 1 |a Wu, Chih-I  |e verfasserin  |4 aut 
700 1 |a Rogers, John A  |e verfasserin  |4 aut 
773 0 8 |i Enthalten in  |t Advanced materials (Deerfield Beach, Fla.)  |d 1998  |g 30(2018), 11 vom: 25. März  |w (DE-627)NLM098206397  |x 1521-4095  |7 nnns 
773 1 8 |g volume:30  |g year:2018  |g number:11  |g day:25  |g month:03 
856 4 0 |u http://dx.doi.org/10.1002/adma.201704955  |3 Volltext 
912 |a GBV_USEFLAG_A 
912 |a SYSFLAG_A 
912 |a GBV_NLM 
912 |a GBV_ILN_350 
951 |a AR 
952 |d 30  |j 2018  |e 11  |b 25  |c 03