Bottom-Up Fabrication of Semiconductive Metal-Organic Framework Ultrathin Films

Bottom-Up Fabrication of Semiconductive Metal-Organic Framework Ultrathin Films

© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 30(2018), 10 vom: 17. März
1. Verfasser: Rubio-Giménez, Víctor (VerfasserIn)
Weitere Verfasser: Galbiati, Marta, Castells-Gil, Javier, Almora-Barrios, Neyvis, Navarro-Sánchez, José, Escorcia-Ariza, Garin, Mattera, Michele, Arnold, Thomas, Rawle, Jonathan, Tatay, Sergio, Coronado, Eugenio, Martí-Gastaldo, Carlos
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2018
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article electrical conductivity metal-organic frameworks self-assembled monolayers ultrathin films
Beschreibung
Zusammenfassung:© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Though generally considered insulating, recent progress on the discovery of conductive porous metal-organic frameworks (MOFs) offers new opportunities for their integration as electroactive components in electronic devices. Compared to classical semiconductors, these metal-organic hybrids combine the crystallinity of inorganic materials with easier chemical functionalization and processability. Still, future development depends on the ability to produce high-quality films with fine control over their orientation, crystallinity, homogeneity, and thickness. Here self-assembled monolayer substrate modification and bottom-up techniques are used to produce preferentially oriented, ultrathin, conductive films of Cu-CAT-1. The approach permits to fabricate and study the electrical response of MOF-based devices incorporating the thinnest MOF film reported thus far (10 nm thick)
Beschreibung:Date Completed 01.08.2018
Date Revised 30.09.2020
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.201704291