Chemical Intercalation of Topological Insulator Grid Nanostructures for High-Performance Transparent Electrodes

© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 29(2017), 44 vom: 19. Nov.
1. Verfasser: Guo, Yunfan (VerfasserIn)
Weitere Verfasser: Zhou, Jinyuan, Liu, Yujing, Zhou, Xu, Yao, Fengrui, Tan, Congwei, Wu, Jinxiong, Lin, Li, Liu, Kaihui, Liu, Zhongfan, Peng, Hailin
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2017
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article Bi2Se3 Cu atoms intercalation topological insulators transparent electrodes
Beschreibung
Zusammenfassung:© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
2D layered nanomaterials with strong covalent bonding within layers and weak van der Waals' interactions between layers have attracted tremendous interest in recent years. Layered Bi2 Se3 is a representative topological insulator material in this family, which holds promise for exploration of the fundamental physics and practical applications such as transparent electrode. Here, a simultaneous enhancement of optical transmittancy and electrical conductivity in Bi2 Se3 grid electrodes by copper-atom intercalation is presented. These Cu-intercalated 2D Bi2 Se3 electrodes exhibit high uniformity over large area and excellent stabilities to environmental perturbations, such as UV light, thermal fluctuation, and mechanical distortion. Remarkably, by intercalating a high density of copper atoms, the electrical and optical performance of Bi2 Se3 grid electrodes is greatly improved from 900 Ω sq-1 , 68% to 300 Ω sq-1 , 82% in the visible range; with better performance of 300 Ω sq-1 , 91% achieved in the near-infrared region. These unique properties of Cu-intercalated topological insulator grid nanostructures may boost their potential applications in high-performance optoelectronics, especially for infrared optoelectronic devices
Beschreibung:Date Completed 18.07.2018
Date Revised 01.10.2020
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.201703424