Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide

Copyright © 2016 Elsevier Ltd. All rights reserved.

Bibliographische Detailangaben
Veröffentlicht in:Waste management (New York, N.Y.). - 1999. - 60(2017) vom: 15. Feb., Seite 652-659
1. Verfasser: Verma, Himanshu Ranjan (VerfasserIn)
Weitere Verfasser: Singh, Kamalesh K, Mankhand, Tilak Raj
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2017
Zugriff auf das übergeordnete Werk:Waste management (New York, N.Y.)
Schlagworte:Journal Article Dimethylacetamide Dissolution Halogenated epoxy resin substrate Liberation Separation Waste printed circuit boards Acetamides Epoxy Resins Metals mehr... Solvents dimethylacetamide JCV5VDB3HY
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520 |a Present work reports the evaluation of dimethylacetamide (DMAc) as a solvent to dissolve the halogenated epoxy resin substrate (HERS) of waste printed circuit boards (WPCBs). Studies revealed that HERS dissolution attributes to the cracking and delamination of WPCB's layers. Variation of the parameters governing the dissolution elucidated that dissolution is directly dependent on temperature and WPCBs concentration in DMAc. The results also showed that increase in the WPCBs size drastically retards the rate of HERS dissolution. After delamination, the spent DMAc was regenerated, and the dissolved HERS was recovered as residue. The chemical structure of regenerated solution and recovered residue were found to be similar to pure DMAc and untreated HERS, respectively. Cyclic usage of regenerated DMAc revealed that 3-5% of DMAc is lost after each usage cycle while its effectiveness to dissolve the HERS remains equivalent to the pure DMAc. The dissolution of HERS ensures the liberation of copper cladded on the surface of WPCBs, and thus the proposed process avoids the requirement of highly energy intensive metal liberation processes 
650 4 |a Journal Article 
650 4 |a Dimethylacetamide 
650 4 |a Dissolution 
650 4 |a Halogenated epoxy resin substrate 
650 4 |a Liberation 
650 4 |a Separation 
650 4 |a Waste printed circuit boards 
650 7 |a Acetamides  |2 NLM 
650 7 |a Epoxy Resins  |2 NLM 
650 7 |a Metals  |2 NLM 
650 7 |a Solvents  |2 NLM 
650 7 |a dimethylacetamide  |2 NLM 
650 7 |a JCV5VDB3HY  |2 NLM 
700 1 |a Singh, Kamalesh K  |e verfasserin  |4 aut 
700 1 |a Mankhand, Tilak Raj  |e verfasserin  |4 aut 
773 0 8 |i Enthalten in  |t Waste management (New York, N.Y.)  |d 1999  |g 60(2017) vom: 15. Feb., Seite 652-659  |w (DE-627)NLM098197061  |x 1879-2456  |7 nnns 
773 1 8 |g volume:60  |g year:2017  |g day:15  |g month:02  |g pages:652-659 
856 4 0 |u http://dx.doi.org/10.1016/j.wasman.2016.12.031  |3 Volltext 
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