Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide
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| Publié dans: | Waste management (New York, N.Y.). - 1999. - 60(2017) vom: 15. Feb., Seite 652-659 |
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| Auteur principal: | |
| Autres auteurs: | , |
| Format: | Article en ligne |
| Langue: | English |
| Publié: |
2017
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| Accès à la collection: | Waste management (New York, N.Y.) |
| Sujets: | Journal Article Dimethylacetamide Dissolution Halogenated epoxy resin substrate Liberation Separation Waste printed circuit boards Acetamides Epoxy Resins Metals plus... |
| Accès en ligne |
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