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231224s2016 xx |||||o 00| ||eng c |
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|a 10.1002/adma.201602339
|2 doi
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|a pubmed24n0875.xml
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|a DE-627
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|e rakwb
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|a eng
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| 100 |
1 |
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|a Kim, Do Hyun
|e verfasserin
|4 aut
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| 245 |
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|a Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
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|c 2016
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|a Text
|b txt
|2 rdacontent
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|a ƒaComputermedien
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|2 rdamedia
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|a ƒa Online-Ressource
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|a Date Completed 17.07.2018
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|a Date Revised 30.09.2020
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|a published: Print-Electronic
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|a Citation Status PubMed-not-MEDLINE
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|a © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
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|a Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections
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|a Journal Article
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|a flexible ACF packaging
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|a flexible NAND flash memory
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|a roll-to-plate technology
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|a ultrathin silicon-based flexible electronics
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|a Yoo, Hyeon Gyun
|e verfasserin
|4 aut
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| 700 |
1 |
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|a Hong, Sung Min
|e verfasserin
|4 aut
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1 |
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|a Jang, Bongkyun
|e verfasserin
|4 aut
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|a Park, Dae Yong
|e verfasserin
|4 aut
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| 700 |
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|a Joe, Daniel J
|e verfasserin
|4 aut
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| 700 |
1 |
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|a Kim, Jae-Hyun
|e verfasserin
|4 aut
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| 700 |
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|a Lee, Keon Jae
|e verfasserin
|4 aut
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| 773 |
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|i Enthalten in
|t Advanced materials (Deerfield Beach, Fla.)
|d 1998
|g 28(2016), 38 vom: 19. Okt., Seite 8371-8378
|w (DE-627)NLM098206397
|x 1521-4095
|7 nnns
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| 773 |
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|g volume:28
|g year:2016
|g number:38
|g day:19
|g month:10
|g pages:8371-8378
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|u http://dx.doi.org/10.1002/adma.201602339
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