Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory

Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory

© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 28(2016), 38 vom: 19. Okt., Seite 8371-8378
1. Verfasser: Kim, Do Hyun (VerfasserIn)
Weitere Verfasser: Yoo, Hyeon Gyun, Hong, Sung Min, Jang, Bongkyun, Park, Dae Yong, Joe, Daniel J, Kim, Jae-Hyun, Lee, Keon Jae
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2016
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article flexible ACF packaging flexible NAND flash memory roll-to-plate technology ultrathin silicon-based flexible electronics
Beschreibung
Zusammenfassung:© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections
Beschreibung:Date Completed 17.07.2018
Date Revised 30.09.2020
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.201602339