Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality

Bibliographische Detailangaben
Veröffentlicht in:	Advanced materials (Deerfield Beach, Fla.). - 1998. - 28(2016), 18 vom: 26. Mai, Seite 3584-91
1. Verfasser:	Naserifar, Naser (VerfasserIn)
Weitere Verfasser:	LeDuc, Philip R, Fedder, Gary K
Format:	Online-Aufsatz
Sprache:	English
Veröffentlicht:	2016
Zugriff auf das übergeordnete Werk:	Advanced materials (Deerfield Beach, Fla.)
Schlagworte:	Journal Article embedded silicon chips energy strain rates poly(dimethylsiloxane) stiffness gradients stretchable electronics


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500			\|a Date Completed 17.07.2018
500			\|a Date Revised 01.10.2020
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500			\|a Citation Status PubMed-not-MEDLINE
520			\|a © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
520			\|a The approach toward a stretchable electronic substrate employs multiple soft polymer layers patterned around silicon chips, which act as surrogates for conventional electronics chips, to create a controllable stiffness gradient. Adding just one intermediate polymer layer results in a six-fold increase in the strain failure threshold enabling the substrate to be stretched to over twice its length before delamination occurs
650		4	\|a Journal Article
650		4	\|a embedded silicon chips
650		4	\|a energy strain rates
650		4	\|a poly(dimethylsiloxane)
650		4	\|a stiffness gradients
650		4	\|a stretchable electronics
700	1		\|a LeDuc, Philip R \|e verfasserin \|4 aut
700	1		\|a Fedder, Gary K \|e verfasserin \|4 aut
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773	1	8	\|g volume:28 \|g year:2016 \|g number:18 \|g day:26 \|g month:05 \|g pages:3584-91
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