Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality
© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
| Veröffentlicht in: | Advanced materials (Deerfield Beach, Fla.). - 1998. - 28(2016), 18 vom: 26. Mai, Seite 3584-91 |
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| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2016
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| Zugriff auf das übergeordnete Werk: | Advanced materials (Deerfield Beach, Fla.) |
| Schlagworte: | Journal Article embedded silicon chips energy strain rates poly(dimethylsiloxane) stiffness gradients stretchable electronics |
| Zusammenfassung: | © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. The approach toward a stretchable electronic substrate employs multiple soft polymer layers patterned around silicon chips, which act as surrogates for conventional electronics chips, to create a controllable stiffness gradient. Adding just one intermediate polymer layer results in a six-fold increase in the strain failure threshold enabling the substrate to be stretched to over twice its length before delamination occurs |
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| Beschreibung: | Date Completed 17.07.2018 Date Revised 01.10.2020 published: Print-Electronic Citation Status PubMed-not-MEDLINE |
| ISSN: | 1521-4095 |
| DOI: | 10.1002/adma.201505818 |