Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics

Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics

© 2015 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 27(2015), 42 vom: 15. Nov., Seite 6582-9
1. Verfasser: Karnaushenko, Daniil (VerfasserIn)
Weitere Verfasser: Karnaushenko, Dmitriy D, Makarov, Denys, Baunack, Stefan, Schäfer, Rudolf, Schmidt, Oliver G
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2015
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article Research Support, Non-U.S. Gov't flexible electronics magnetic field sensors magneto-impedance self-assembly strain engineering
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520 |a © 2015 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. 
520 |a A novel method relying on strain engineering to realize arrays of on-chip-integrated giant magneto-impedance (GMI) sensors equipped with pick-up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography 
650 4 |a Journal Article 
650 4 |a Research Support, Non-U.S. Gov't 
650 4 |a flexible electronics 
650 4 |a magnetic field sensors 
650 4 |a magneto-impedance 
650 4 |a self-assembly 
650 4 |a strain engineering 
700 1 |a Karnaushenko, Dmitriy D  |e verfasserin  |4 aut 
700 1 |a Makarov, Denys  |e verfasserin  |4 aut 
700 1 |a Baunack, Stefan  |e verfasserin  |4 aut 
700 1 |a Schäfer, Rudolf  |e verfasserin  |4 aut 
700 1 |a Schmidt, Oliver G  |e verfasserin  |4 aut 
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