Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics

Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics

© 2015 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 27(2015), 42 vom: 15. Nov., Seite 6582-9
1. Verfasser: Karnaushenko, Daniil (VerfasserIn)
Weitere Verfasser: Karnaushenko, Dmitriy D, Makarov, Denys, Baunack, Stefan, Schäfer, Rudolf, Schmidt, Oliver G
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2015
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article Research Support, Non-U.S. Gov't flexible electronics magnetic field sensors magneto-impedance self-assembly strain engineering
Beschreibung
Zusammenfassung:© 2015 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
A novel method relying on strain engineering to realize arrays of on-chip-integrated giant magneto-impedance (GMI) sensors equipped with pick-up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography
Beschreibung:Date Completed 23.08.2016
Date Revised 30.09.2020
published: Print-Electronic
Citation Status MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.201503127