Copper stabilization in beneficial use of waterworks sludge and copper-laden electroplating sludge for ceramic materials

Copper stabilization in beneficial use of waterworks sludge and copper-laden electroplating sludge for ceramic materials

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Détails bibliographiques
Publié dans:Waste management (New York, N.Y.). - 1999. - 34(2014), 6 vom: 13. Juni, Seite 1085-91
Auteur principal: Tang, Yuanyuan (Auteur)
Autres auteurs: Chan, Siu-Wai, Shih, Kaimin
Format: Article en ligne
Langue:English
Publié: 2014
Accès à la collection:Waste management (New York, N.Y.)
Sujets:Journal Article Research Support, Non-U.S. Gov't Research Support, U.S. Gov't, Non-P.H.S. Ceramic materials Electroplating sludge Leaching Rietveld refinement Waterworks sludge Sewage Copper 789U1901C5
Accès en ligne Volltext