APA Zitierstil

Tang, Y., Chan, S., & Shih, K. (2014). Copper stabilization in beneficial use of waterworks sludge and copper-laden electroplating sludge for ceramic materials. Waste management (New York, N.Y.), 34(6), 1085. https://doi.org/10.1016/j.wasman.2013.07.001

Chicago Zitierstil

Tang, Yuanyuan, Siu-Wai Chan, und Kaimin Shih. "Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials." Waste Management (New York, N.Y.) 34, no. 6 (2014): 1085. https://dx.doi.org/10.1016/j.wasman.2013.07.001.

MLA Zitierstil

Tang, Yuanyuan, et al. "Copper Stabilization in Beneficial Use of Waterworks Sludge and Copper-laden Electroplating Sludge for Ceramic Materials." Waste Management (New York, N.Y.), vol. 34, no. 6, 2014, p. 1085.