Directed 2D-to-3D pattern transfer method for controlled fabrication of topologically complex 3D features in silicon
A process that allows control over the 3D motion of catalyst nanostructures during metal-assisted chemical etching by their local pinning prior to etching is demonstrated. The pinning material acts as a fulcrum for rotation of the catalyst structures resulting in etching of silicon features with rot...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Advanced materials (Deerfield Beach, Fla.). - 1998. - 23(2011), 5 vom: 01. Feb., Seite 659-63
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| 1. Verfasser: |
Rykaczewski, Konrad
(VerfasserIn) |
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| Weitere Verfasser: |
Hildreth, Owen J,
Wong, Ching P,
Fedorov, Andrei G,
Scott, John Henry J |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2011
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| Zugriff auf das übergeordnete Werk: | Advanced materials (Deerfield Beach, Fla.)
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| Schlagworte: | Letter
Research Support, American Recovery and Reinvestment Act
Research Support, U.S. Gov't, Non-P.H.S.
Silicon
Z4152N8IUI |
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