Formation of ultrasmooth and highly stable copper surfaces through annealing and self-assembly of organic monolayers

Copper (Cu) has been extensively used as an interconnect material for microelectronic devices because of its high electrical and thermal conductivity and excellent electromigration resistance. However, the formation of relatively rough Cu surfaces ( approximately 5 nm roughness) and Cu-oxide layers...

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Publié dans:	Langmuir : the ACS journal of surfaces and colloids. - 1985. - 26(2010), 1 vom: 05. Jan., Seite 191-201
Auteur principal:	Platzman, Ilia (Auteur)
Autres auteurs:	Saguy, Cecile, Brener, Reuven, Tannenbaum, Rina, Haick, Hossam
Format:	Article en ligne
Langue:	English
Publié:	2010
Accès à la collection:	Langmuir : the ACS journal of surfaces and colloids
Sujets:	Journal Article