Formation of ultrasmooth and highly stable copper surfaces through annealing and self-assembly of organic monolayers
Copper (Cu) has been extensively used as an interconnect material for microelectronic devices because of its high electrical and thermal conductivity and excellent electromigration resistance. However, the formation of relatively rough Cu surfaces ( approximately 5 nm roughness) and Cu-oxide layers...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 26(2010), 1 vom: 05. Jan., Seite 191-201
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| 1. Verfasser: |
Platzman, Ilia
(VerfasserIn) |
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| Weitere Verfasser: |
Saguy, Cecile,
Brener, Reuven,
Tannenbaum, Rina,
Haick, Hossam |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2010
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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| Schlagworte: | Journal Article |
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