High-energy electron beam lithography of octadecylphosphonic acid monolayers on aluminum

Monolayers of octadecylphosphonic acid were self-assembled on silicon substrates sputter coated with aluminum. Patterning of the self-assembled monolayer was achieved by high-energy electron (50 kV) illumination using an electron beam lithography tool. The change in chemical composition of the expos...

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Veröffentlicht in:Langmuir : the ACS journal of surfaces and colloids. - 1992. - 24(2008), 5 vom: 04. März, Seite 2057-63
1. Verfasser: Gadegaard, Nikolaj (VerfasserIn)
Weitere Verfasser: Chen, Xinyong, Rutten, Frank J M, Alexander, Morgan R
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2008
Zugriff auf das übergeordnete Werk:Langmuir : the ACS journal of surfaces and colloids
Schlagworte:Journal Article Organophosphonates Aluminum CPD4NFA903 Silicon Z4152N8IUI
Beschreibung
Zusammenfassung:Monolayers of octadecylphosphonic acid were self-assembled on silicon substrates sputter coated with aluminum. Patterning of the self-assembled monolayer was achieved by high-energy electron (50 kV) illumination using an electron beam lithography tool. The change in chemical composition of the exposed monolayer was investigated by time-of-flight secondary ion mass spectrometry over an area of 100 x 100 microm2. The electron dose required to fully expose the SAM was found to be about 6 mC/cm2. Gratings were exposed with line widths from 10 microm to 100 nm. The resulting patterns were imaged using friction force microscopy. It was found that the minimum line width is limited to ca. 100 nm by the patterning resolution. The pattern resolution achieved, ca. 40 nm, is equal to the grain size of the sputter-coated aluminum layer, and the possibility that the grain size limits the pattern resolution is discussed
Beschreibung:Date Completed 27.05.2008
Date Revised 21.11.2013
published: Print-Electronic
Citation Status MEDLINE
ISSN:1520-5827
DOI:10.1021/la701733n