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|a DE-627
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|e rakwb
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|a eng
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|a Huang, Yonggang Y
|e verfasserin
|4 aut
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|a Stamp collapse in soft lithography
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|c 2005
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|a Text
|b txt
|2 rdacontent
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|a ohne Hilfsmittel zu benutzen
|b n
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|2 rdacarrier
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|a Date Completed 03.04.2007
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|a Date Revised 10.08.2005
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|a published: Print
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|a Citation Status PubMed-not-MEDLINE
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|a We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data
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|a Journal Article
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|a Zhou, Weixing
|e verfasserin
|4 aut
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|a Hsia, K J
|e verfasserin
|4 aut
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|a Menard, Etienne
|e verfasserin
|4 aut
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|a Park, Jang-Ung
|e verfasserin
|4 aut
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|a Rogers, John A
|e verfasserin
|4 aut
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|a Alleyne, Andrew G
|e verfasserin
|4 aut
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|i Enthalten in
|t Langmuir : the ACS journal of surfaces and colloids
|d 1992
|g 21(2005), 17 vom: 16. Aug., Seite 8058-68
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|x 1520-5827
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|g volume:21
|g year:2005
|g number:17
|g day:16
|g month:08
|g pages:8058-68
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