From Printed Devices to Vertically Stacked, 3D Flexible Hybrid Systems

© 2025 The Author(s). Advanced Materials published by Wiley‐VCH GmbH.

Détails bibliographiques
Publié dans:Advanced materials (Deerfield Beach, Fla.). - 1998. - 37(2025), 10 vom: 13. März, Seite e2411151
Auteur principal: Liu, Fengyuan (Auteur)
Autres auteurs: Christou, Adamos, Dahiya, Abhishek Singh, Dahiya, Ravinder
Format: Article en ligne
Langue:English
Publié: 2025
Accès à la collection:Advanced materials (Deerfield Beach, Fla.)
Sujets:Journal Article Review 3D integration green manufacturing heterogeneous integration printed and flexible electronics resource efficiency