Selective leaching of rare earths, base metals and precious metals from used smartphones

Discarded smartphones represent a valuable source of rare earths (REE), base metals and precious metals. This study focussed on the optimisation of three-stage selective leaching conditions for REE, copper and precious metals (Au and Ag), respectively, contained in printed circuit boards (PCBs) foun...

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Veröffentlicht in:Environmental technology. - 1993. - (2024) vom: 14. Nov., Seite 1-16
1. Verfasser: Diallo, Salmata (VerfasserIn)
Weitere Verfasser: Tran, Lan-Huong, Larivière, Dominic, Blais, Jean-François
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2024
Zugriff auf das übergeordnete Werk:Environmental technology
Schlagworte:Journal Article E-waste Selective leaching copper precious metals rare earth element
Beschreibung
Zusammenfassung:Discarded smartphones represent a valuable source of rare earths (REE), base metals and precious metals. This study focussed on the optimisation of three-stage selective leaching conditions for REE, copper and precious metals (Au and Ag), respectively, contained in printed circuit boards (PCBs) found in end-of-life smartphones. The effects of several leaching conditions, such as sulphuric acid and thiourea concentrations, were investigated using a statistical approach based on a design of experiments using Box-Behnken methodology. Optimum leaching efficiencies were achieved when PCB powder was contacted (solid concentration of 100 g/L) with (1) a 0.2 M H2SO4 solution for 30 min at a temperature of 20°C for REEs; (2) a 1 M H2SO4 solution with 67 g H2O2/L for 180 min at 80°C for Cu and (3) a solution of 42 g thiourea/L in 0.1 M H2SO4 and 9 g Fe2(SO4)3/L for 120 min at 20°C for Au and Ag. Using these optimal conditions, a complete leaching procedure included an REE solubilisation step and a base metal leaching step, both repeated twice, and a precious metal leaching step. This procedure solubilised 91% of the REE, 100% of the copper, 98% of the gold and 87% of the silver contained in the PCB powder during their respective leaching stages
Beschreibung:Date Revised 14.11.2024
published: Print-Electronic
Citation Status Publisher
ISSN:1479-487X
DOI:10.1080/09593330.2024.2423906