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|a 10.1021/acs.langmuir.4c01554
|2 doi
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|a pubmed24n1465.xml
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|a DE-627
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|e rakwb
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|a eng
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|a Pang, Chao
|e verfasserin
|4 aut
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|a DNA-Templated Nanofabrication of CdS-Au Nanoscale Schottky Contacts and Electrical Characterization
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|c 2024
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|a Text
|b txt
|2 rdacontent
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|a ƒaComputermedien
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|2 rdamedia
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|a ƒa Online-Ressource
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|2 rdacarrier
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|a Date Completed 09.07.2024
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|a Date Revised 09.07.2024
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|a published: Print-Electronic
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|a Citation Status MEDLINE
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|a DNA-templated nanofabrication presents an innovative approach to creating self-assembled nanoscale metal-semiconductor-based Schottky contacts, which can advance nanoelectronics. Herein, we report the successful fabrication of metal-semiconductor Schottky contacts using a DNA origami scaffold. The scaffold, consisting of DNA strands organized into a specific linear architecture, facilitates the competitive arrangement of Au and CdS nanorods, forming heterojunctions, and addresses previous limitations in low electrical conductance making DNA-templated electronics with semiconductor nanomaterials. Electroless gold plating extends the Au nanorods and makes the necessary electrical contacts. Tungsten electrical connection lines are further created by electron beam-induced deposition. Electrical characterization reveals nonlinear Schottky barrier behavior, with electrical conductance ranging from 0.5 × 10-4 to 1.7 × 10-4 S. The conductance of these DNA-templated junctions is several million times higher than with our prior Schottky contacts. Our research establishes an innovative self-assembly approach with applicable metal and semiconductor materials for making highly conductive nanoscale Schottky contacts, paving the way for the future development of DNA-based nanoscale electronics
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|a Journal Article
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|a Gold
|2 NLM
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|a 7440-57-5
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|a Cadmium Compounds
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|a Sulfides
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|a DNA
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|a 057EZR4Z7Q
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|a Karlinsey, Benjamin T
|e verfasserin
|4 aut
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|a Ward, Megan
|e verfasserin
|4 aut
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|a Harrison, Roger G
|e verfasserin
|4 aut
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|a Davis, Robert C
|e verfasserin
|4 aut
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|a Woolley, Adam T
|e verfasserin
|4 aut
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|i Enthalten in
|t Langmuir : the ACS journal of surfaces and colloids
|d 1992
|g 40(2024), 27 vom: 09. Juli, Seite 14076-14085
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|x 1520-5827
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|g volume:40
|g year:2024
|g number:27
|g day:09
|g month:07
|g pages:14076-14085
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|u http://dx.doi.org/10.1021/acs.langmuir.4c01554
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