Enhancing the Conductivity and Thermoelectric Performance of Semicrystalline Conducting Polymers through Controlled Tie Chain Incorporation

© 2024 The Authors. Advanced Materials published by Wiley‐VCH GmbH.

Détails bibliographiques
Publié dans:Advanced materials (Deerfield Beach, Fla.). - 1998. - 36(2024), 28 vom: 07. Juli, Seite e2310480
Auteur principal: Zhu, Wenjin (Auteur)
Autres auteurs: Qiu, Xinkai, Laulainen, Joonatan E M, Un, Hio-Leng, Ren, Xinglong, Xiao, Mingfei, Freychet, Guillaume, Vacek, Petr, Tjhe, Dion, He, Qiao, Wood, William, Wang, Zichen, Zhang, Youcheng, Qu, Zhengkang, Asatryan, Jesika, Martin, Jaime, Heeney, Martin, McNeill, Christopher R, Midgley, Paul A, Jacobs, Ian E, Sirringhaus, Henning
Format: Article en ligne
Langue:English
Publié: 2024
Accès à la collection:Advanced materials (Deerfield Beach, Fla.)
Sujets:Journal Article ion exchange doping organic thermoelectrics polymer alignment tie chains