Cao, C., Ji, S., Jiang, Y., Su, J., Xia, H., Li, H., . . . Chen, X. (2024). Mitigating the Overheat of Stretchable Electronic Devices Via High-Enthalpy Thermal Dissipation of Hydrogel Encapsulation. Advanced materials (Deerfield Beach, Fla.), 36(26), . https://doi.org/10.1002/adma.202401875
Style de citation ChicagoCao, Can, et al. "Mitigating the Overheat of Stretchable Electronic Devices Via High-Enthalpy Thermal Dissipation of Hydrogel Encapsulation." Advanced Materials (Deerfield Beach, Fla.) 36, no. 26 (2024). https://dx.doi.org/10.1002/adma.202401875.
Style de citation MLACao, Can, et al. "Mitigating the Overheat of Stretchable Electronic Devices Via High-Enthalpy Thermal Dissipation of Hydrogel Encapsulation." Advanced Materials (Deerfield Beach, Fla.), vol. 36, no. 26, 2024.