Manipulating Stacking Fault Energy to Achieve Crack Inhibition and Superior Strength-Ductility Synergy in an Additively Manufactured High-Entropy Alloy
© 2024 Wiley‐VCH GmbH.
| Publié dans: | Advanced materials (Deerfield Beach, Fla.). - 1998. - 36(2024), 34 vom: 14. Aug., Seite e2310160 |
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| Auteur principal: | |
| Autres auteurs: | , , , , |
| Format: | Article en ligne |
| Langue: | English |
| Publié: |
2024
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| Accès à la collection: | Advanced materials (Deerfield Beach, Fla.) |
| Sujets: | Journal Article additive manufacturing crack free high‐entropy alloy laser powder bed fusion stacking fault energy |
| Résumé: | © 2024 Wiley‐VCH GmbH. Additive manufacturing (AM) is a revolutionary technology that heralds a new era in metal processing, yet the quality of AM-produced parts is inevitably compromised by cracking induced by severe residual stress. In this study, a novel approach is presented to inhibit cracks and enhance the mechanical performances of AM-produced alloys by manipulating stacking fault energy (SFE). A high-entropy alloy (HEA) based on an equimolar FeCoCrNi composition is selected as the prototype material due to the presence of microcracks during laser powder bed fusion (LPBF) AM process. Introducing a small amount (≈2.4 at%) of Al doping can effectively lower SFE and yield the formation of multiscale microstructures that efficiently dissipate thermal stress during LPBF processing. Distinct from the Al-free HEA containing visible microcracks, the Al-doped HEA (Al0.1CoCrFeNi) is crack free and demonstrates ≈55% improvement in elongation without compromising tensile strength. Additionally, the lowered SFE enhances the resistance to crack propagation, thereby improving the durability of AM-printed products. By manipulating SFE, the thermal cycle-induced stress during the printing process can be effectively consumed via stacking faults formation, and the proposed strategy offers novel insights into the development of crack-free alloys with superior strength-ductility synergy for intricate structural applications |
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| Description: | Date Revised 21.08.2024 published: Print-Electronic Citation Status PubMed-not-MEDLINE |
| ISSN: | 1521-4095 |
| DOI: | 10.1002/adma.202310160 |