Willis, J., Claes, R., Zhou, Q., Giantomassi, M., Rignanese, G., Hautier, G., & Scanlon, D. O. (2023). Limits to Hole Mobility and Doping in Copper Iodide. Chemistry of materials : a publication of the American Chemical Society, 35(21), 8995. https://doi.org/10.1021/acs.chemmater.3c01628
Chicago ZitierstilWillis, Joe, Romain Claes, Qi Zhou, Matteo Giantomassi, Gian-Marco Rignanese, Geoffroy Hautier, und David O. Scanlon. "Limits to Hole Mobility and Doping in Copper Iodide." Chemistry of Materials : A Publication of the American Chemical Society 35, no. 21 (2023): 8995. https://dx.doi.org/10.1021/acs.chemmater.3c01628.
MLA ZitierstilWillis, Joe, et al. "Limits to Hole Mobility and Doping in Copper Iodide." Chemistry of Materials : A Publication of the American Chemical Society, vol. 35, no. 21, 2023, p. 8995.