Shear Wave Ultrasound Inspection of Flaws in Silicon Wafers Using Focused Transducers
Silicon parts can contain micrometer-sized vertical cracks that are challenging to detect. Inspection using high-frequency focused ultrasound has shown promise for detecting defects of this size and geometry. However, implementing focused ultrasound to inspect anisotropic media can prove challenging...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 70(2023), 11 vom: 03. Nov., Seite 1506-1515
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| 1. Verfasser: |
Katch, Lauren
(VerfasserIn) |
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| Weitere Verfasser: |
Yeoh, Wei Yi,
Touzanov, Odissei,
Pacheco, Mario,
Lan, Bo,
Arguelles, Andrea P |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2023
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| Zugriff auf das übergeordnete Werk: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control
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| Schlagworte: | Journal Article |
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