Silver-Copper Alloy Nanoinks for Ambient Temperature Sintering
There is an increasing need to reduce the silver content in silver-based inks or pastes and achieve low-temperature sintering for scalable and low-cost production of printed wearable electronics. This need depends on the ability to control the metal composition and the surface properties of the nano...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 38(2022), 18 vom: 10. Mai, Seite 5633-5644
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| 1. Verfasser: |
Robinson, Richard
(VerfasserIn) |
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| Weitere Verfasser: |
Krause, Virginia,
Wang, Shan,
Yan, Shan,
Shang, Guojun,
Gordon, Justine,
Tycko, Serena,
Zhong, Chuan-Jian |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2022
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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| Schlagworte: | Journal Article
Research Support, U.S. Gov't, Non-P.H.S.
Alloys
Silver
3M4G523W1G
Copper
789U1901C5 |
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