APA Zitierstil

Mariello, M., Kim, K., Wu, K., Lacour, S. P., & Leterrier, Y. (2022). Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods. Advanced materials (Deerfield Beach, Fla.), 34(34), . https://doi.org/10.1002/adma.202201129

Chicago Zitierstil

Mariello, Massimo, Kyungjin Kim, Kangling Wu, Stéphanie P. Lacour, und Yves Leterrier. "Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods." Advanced Materials (Deerfield Beach, Fla.) 34, no. 34 (2022). https://dx.doi.org/10.1002/adma.202201129.

MLA Zitierstil

Mariello, Massimo, et al. "Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods." Advanced Materials (Deerfield Beach, Fla.), vol. 34, no. 34, 2022.