Silicon and nitric oxide interplay alleviates copper induced toxicity in mung bean seedlings
Copyright © 2021. Published by Elsevier Masson SAS.
Veröffentlicht in: | Plant physiology and biochemistry : PPB. - 1991. - 167(2021) vom: 29. Okt., Seite 713-722 |
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1. Verfasser: | |
Weitere Verfasser: | , , , , , , , |
Format: | Online-Aufsatz |
Sprache: | English |
Veröffentlicht: |
2021
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Zugriff auf das übergeordnete Werk: | Plant physiology and biochemistry : PPB |
Schlagworte: | Journal Article Copper Mung bean Oxidative stress SNP Silicon Antioxidants Nitric Oxide 31C4KY9ESH 789U1901C5 mehr... |
Zusammenfassung: | Copyright © 2021. Published by Elsevier Masson SAS. The present study was aimed to investigate copper (Cu) toxicity alleviatory potential of silicon in Vigna radiata L. (mung bean) seedlings. Moreover, attention has also been paid to find out whether endogenous nitric oxide (NO) has any role in Si-governed alleviation of Cu stress. The length of root and shoot, fresh weight, and biochemical attributes were adversely affected by Cu exposure. However, application of Si rescued negative effects of Cu. Cu exposure decreased cell viability, and enhanced cell death and levels of oxidative stress markers (O2•‾, H2O2 and MDA), but Si significantly mitigated these effects of Cu. Application of Cu substantially stimulated the activities of superoxide dismutase and guaiacol peroxidase while inhibited activity of catalase. However, Si addition reversed this effect of Cu. Ascorbate and glutathione contents in roots and shoots were declined by Cu but stimulated by Si. Moreover, we noticed that addition of Nω-nitro-L-arginine methyl ester hydrochloride (L-NAME) and sodium tungstate (Tung) further augmented Cu toxicity but addition of sodium nitroprusside rescued adverse effects of L-NAME and Tung. Altogether, data suggest that though Si was able in alleviating Cu toxicity in mung bean seedlings but it requires endogenous nitric oxide |
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Beschreibung: | Date Completed 13.10.2021 Date Revised 13.10.2021 published: Print-Electronic Citation Status MEDLINE |
ISSN: | 1873-2690 |
DOI: | 10.1016/j.plaphy.2021.08.011 |